In a nutshell: Micron’s new 232-layer NAND has the perfect TLC density within the business at 14.6 Gb/mm2. It options stepped forward garage capability, as much as 1Tb in step with die and 2TB in step with package deal. The corporate may be promoting over 75 p.c upper learn bandwidth and two times the write bandwidth of its past-gen 176-layer flash.
Micron introduced that it has began transport its 232-layer NAND to purchasers in element shape and thru its An important SSD client product line, regaining business management in the case of layer rely.
The corporate’s 6th era 3-D NAND makes use of two 116-layer decks in a string-stacked design. It has a density of 14.6 Gbit/mm2, over 40 p.c upper than its preceding 176-layer flash. Micron additionally claims its areal density is 35 to one hundred pc more than competing TLC merchandise.
This greater density allowed the corporate to shrink its chip packaging by way of 28 p.c in comparison to last-gen, all the way down to 11.5mm x 13.5mm. Micron’s new TLC flash has a die capability of 1Tb, which means it could now produce 2TB applications when stacking 16 dies in combination.
The brand new 232-layer NAND additionally options efficiency enhancements because it will increase the choice of planes in step with die from 4 to 6, bettering parallelism. ONFi 5.0 will increase switch charges by way of 50 p.c to two,400 MT/s whilst introducing a brand new NV-LPDDR4 interface that delivers per-bit power switch financial savings of over 30 p.c. Total, Micron is touting over 75 p.c upper learn bandwidth, with write bandwidth doubling in comparison to previous-gen NAND.
Micron’s 232-layer NAND is lately in quantity manufacturing in its Singapore fab. The primary SSDs supplied with it’ll most probably come to marketplace in a couple of months.